Capability Roadmap
Traditional PCB - 1
 
|
2020 Standard |
2020 Advanced |
2021 | 2022 | |
|
Line Width/Space (um): |
50/50 | 40/40 | 40/40 | 35/35 | |
|
Pattern Position Tolerance (um): |
+/-30 | +/-25 | +/-25 | +/-20 | |
|
Impedance Tolerance: |
+/-8% | +/-5% | +/-5% | +/-4% | |
|
Maximum Layer Count: (Traditional & HDI) |
26L | 30L | 30L | 36L | |
|
Routing Tolerance: (um) |
+/-75 | +/-50 | +/-50 | +/-35 | |
|
Finished Board Thickness: (mm) |
0.2~3.5 | 0.15~4.0 | 0.15~4.0 | 0.1~4.0 | |
|
Board Thickness Tolerance (mm) |
Thickness > 0.5mm: |
+/-10% | +/-8% | +/-8% | +/-6% |
|
Thickness ≤ 0.5mm: |
+/-0.05 | +/-0.03 | +/-0.03 | +/-0.03 | |
Traditional PCB - 2
 
|
2020 Standard |
2020 Advanced |
2021 | 2022 | |
| Min. Mechanical Drill Size(um): | 100 | 75 | 75 | 75 | |
| Hole To Hole Accuracy(um): | +/-50 | +/-50 | +/-50 | +/-38 | |
|
Max. Aspect Ratio (Through-hole): |
0.1≤ Dia. < 0.2mm: | 6:1 | 8:1 | 8:1 | 8:1 |
| 0.2≤ Dia.< 0.3mm: | 10:1 | 12:1 | 16:1 | 18:1 | |
| 0.3mm ≤ Dia.: | 11:1 | 15:1 | 18:1 | 20:1 | |
|
Through Hole Size Tolerance (um): |
NPTH: | +/-50 | +/-25 | +/-38 | +/-25 |
| PTH: | +/-75 | +/-50 | +/-50 | +/-38 | |
| Press Fit Hole: | +/-50 | +/-38 | +/-38 | +/-38 | |
|
Mechanical Blind Hole: |
Min. Hole Size: (um) |
200 | 150 | 150 | 100 |
|
Hole Size Tolerance: (um) |
+/-75 | +/-50 | +/-50 | +/-38 | |
|
Depth Precision: (um) |
+/-50 | +/-25 | +/-38 | +/-25 | |
| Max. Aspect Ratio: | 0.8:1 | 1:1 | 0.9:1 | 1:1 | |
HDI
 
|
2020 Standard |
2020 Advanced |
2021 | 2022 |
| Maximum Layer count of Any-layer: | 14L | 16L | 16L | 18L |
| Minimum Blind via size(mm): | 0.075 | 0.075 | 0.075 | 0.075 |
| Max Blind Via Aspect Ratio: | 0.7:1 | 0.8:1 | 0.8:1 | 1:1 |
| Min Blind via Capture pad(mm): | Dia.+0.15 | Dia.+0.1 | Dia.+0.13 | Dia.+0.1 |
| Min Blind via Target Pad(mm): | Dia.+0.15 | Dia.+0.1 | Dia.+0.13 | Dia.+0.1 |
| Filling via dimple value(um): | ≤15 | ≤10 | ≤10 | ≤10 |
| Maximum lamination times: | 6 | 7 | 7 | 8 |
Rigid-flex1
| Item | Flex - Rigid | Regal | Semi-Flex | |
| Figure |
 
|
 
|
 
|
|
| Flexible Material | Polyimide |
FR4 + Coverlay (Polyimide) |
FR4 | |
| Flexible thickness |
0.025~0.1mm (Exclude copper) |
0.05~0.1mm (Exclude copper) |
Remained Thickness: 0.25+/-0.05mm (Dedicated Material: EM825(I)) |
|
| Bending angle | Max 180° | Max 180° |
Max 180° (Flex layer≤2) Max 90° (Flex layer>2) |
|
|
Flexural Endurance IPC-TM-650, Method 2.4.3. |
<1000 cycle | < 25 cycle | NA | |
|
Bending Test 1) Mandrel diam: 6.25mm |
<10K cycle (Bending Angle:180°) |
<500 cycle (Bending Angle:180°) |
<10 cycle (Bending Angle:180°) |
|
| Application |
Flex to install & Dynamic(Single side) |
Flex to install | Flex to install |
|
2020 Standard |
2020 Advanced |
2021 | 2022 |
| Maximum Layer count of Any-layer: | 14L | 16L | 16L | 18L |
| Minimum Blind via size(mm): | 0.075 | 0.075 | 0.075 | 0.075 |
| Max Blind Via Aspect Ratio: | 0.7:1 | 0.8:1 | 0.8:1 | 1:1 |
| Min Blind via Capture pad(mm): | Dia.+0.15 | Dia.+0.1 | Dia.+0.13 | Dia.+0.1 |
| Min Blind via Target Pad(mm): | Dia.+0.15 | Dia.+0.1 | Dia.+0.13 | Dia.+0.1 |
| Filling via dimple value(um): | ≤15 | ≤10 | ≤10 | ≤10 |
| Maximum lamination times: | 6 | 7 | 7 | 8 |
