| Technology | Product Categories | Product Categories | Min. Diameter of Laser Vias | Max. Lamination Times | Max. Layer Counts | Copper Filling for Laser Vias |
| Laser Via |  | Anylayer | 0.075mm | 6~7 | 14~16 layers | Y |
| Laser Via |  | VOP (Via On Capping) | 0.075mm | 6+N+6 | 20~26 layers | Y |
| Laser Via |  | Skip Via | 0.2mm | 6~7 | 20~26 layers | N |
| Technologies | Product Categories | Product Categories | Min. Diameter of Through Via | Diameter of Back Drill Holes | Max. Board Depth | Spacing between Back Drill Holes |
| Back drill |  | Back drill | 0.25mm | 0.35 - 0.45mm 0.45 - 0.80mm 0.80 - 6.00mm | 4.85mm 4.85mm 4.85mm | Min 0.2mm |
| Technology | Product Categories | Product Categories | Bending material | Min. Flex Thickness | Max. Layer Counts | Max. Flex Layer Counts | Bending angle |
| Flex-Rigid |  | Flex-Rigid (Flex in the Middle) | Polyimide | 0.075mm | 26 layers | 6 layers | 360° |
| Flex-Rigid |  | Flex-Rigid (Flex on the external) | Polyimide | 0.075mm | 26 layers | 4 layers | Max 180° |
| Flex-Rigid |  | Regal | FR4 + Coverlay(Polyimide) | 0.075mm | 26 layers | 4 layers | Max 180° |
| Flex-Rigid |  | Semi-Flex | FR4 + Flexible solder mask | Min. residual thickness: 0.25mm | 26 layers | 4 layers | Max 180°(Flex layer≤2) Max 90°(Flex layer>2) |
| Technology | Product Categories | Product Categories | Drilling Categories | Material Categories |
| High frequency and high speed |  | Hybrid lamination | Mechanical drilling | Modified FR4 / PPE / PPO / Hydrocarbon / PTFE + Normal FR4 |
| High frequency and high speed |  | HDI | Laser drilling + mechanical drilling | Modified FR4 / PPE / PPO |
| High frequency and high speed |  | High Layer Count (26~30L) | Mechanical drilling | Modified FR4 / PPE / PPO |
| High frequency and high speed |  | Flex-Rigid | Laser drilling + mechanical drilling | Modified FR4 / PPE / PPO + Polyimide |
| Technology | Product Categories | Product Categories | Max. Copper Thickness of Inner Layers | Max. Copper Thickness of Outer Layers | Max. Board Thickness | Feature |
| Heavy Copper |  | Heavy Copper | 8 OZ | 10 OZ | 4.0mm | Applied for components with high thermal dissipation demands. |
| Technology | Product Categories | Product Categories | Drilling type | Description | Features | |
| Cavity |  | Embossed table design | Laser drilling + mechanical drilling | Embossed tables in the middle of board. | Getting more space for assembling, and lesser loss of signal transmission . | |
| Cavity |  | Gold fingers in cavity area | Laser drilling + mechanical drilling | Gold fingers in cavity area / electro-plating gold fingers / gold finger beveling . | Match standard connectors' specification, and more multiple functions in other areas . | |
| Cavity |  | BGA in cavity area | Laser drilling + mechanical drilling | BGA in cavity area | Getting more space for assembling, and lesser loss of signal transmission. | |
| Cavity |  | Cavity area build with CO2 laser drilling | Laser drilling + mechanical drilling | Cavity (without copper / with copper) in the middle of wire bonding areas . | Getting more space for assembling. | |
| Technology | Product Categories | Product Categories | Min. Copper coin size | Max. Copper coin size | Min. Copper coin thickness | Max. Copper coin thickness |
| Copper Inlay |  | Copper coin throughout the board | 3.0*3.0mm | 80*80mm | 1.0mm | 3.0mm |
| Copper Inlay |  | Copper coin embedded in the board (Laser via drilled on the surface of copper Inlay ) | 3.0*3.0mm | 80*80mm | 1.0mm | 2.8mm |
